• Home
  • Technologies
  • Circuit protection

Circuit protection

In order to protect electronic components from external influences, we offer various coating processes.

Would you like to know which coatings and housing variants make sense for your circuit?

Coating processes

Coating process Circuit protection
  • Paint passivation by dipping process
  • Passivation with Hysol
  • Passivation and encapsulation with silicone-containing materials in a silicone chamber
  • Masking, unmasking, housing, wrapping, immersion wrapping, potting, etc.
  • Materials: pastes, lacquers and two-component silicones, Hysol, etc.
  • Parylen

Hermetic housings

  • Metal-glass, ceramic-metal, ceramic-ceramic closure
  • Heating and emptying for vacuum applications
  • Inert gas filling
  • Various welding and soldering processes: Laser and resistance welding, vacuum and filling gas soldering
Hybrid circuit with hermetic ceramic package
Hybrid circuit with hermetic ceramic package

Parylen coating

Parylene coating can significantly improve the functional reliability of electronic components. It is often the ideal solution for protecting high-quality components. The coating is deposited on the substrate in a vacuum by resublimation from the gas phase as a pore-free and transparent polymer film. The commonly used term parylene or parylene is the abbreviation for the chemically correct term poly-para-xylylene. Parylene is characterized by extraordinarily high resistance to almost all aggressive media and solvents. Even with minimum layer thickness, the permeability for water is exceptionally low. In addition, the aging resistance of the plastic is very high.
Completely contour-conform coating - In contrast to liquid coatings, Parylene   also reaches those areas of the component that remain unattained by liquids from the gas phase.

A coating with parylene is an option if:

Sensitive electronic circuits and assemblies are optimally protected against harmful influences
Sensitive electronic circuits and assemblies are optimally protected against harmful influences
  • Electronic components must meet the highest safety and durability requirements
  • Components are exposed to extreme environmental conditions.
  • Aggressive media must not cause damage.
  • Metals must not oxidize.
  • Good sliding properties and low abrasion are important.
  • Highest performance and certifications according to US-MIl- and US NBC are required.
  • For safety-relevant applications according to UL (Underwriters Laboratories).
  • Parylene is still approved by FDA and USP (United States Pharmacopeia) Class VI.

Parylen types

Parylene N Very good gap mobility and maximum coating penetration
Optimum dielectric properties and dielectric strength
Temperature stability up to 90 °C
Parylene C Very good barrier effect. High moisture protection due to hydrophobic properties.
High elasticity, therefore suitable for plastic and elastomer coatings.
High layer thickness growth (up to 10 µm/h)
Temperature stability up to 125 °C
Parylene D Highly hydrophobic properties
High-temperature stability up to 180 °C
Used to protect electronic components in the aerospace industry.
Parylene F Highest temperature resistance up to 350 °C