Wire bonding

Chip & wire bonding

Micro-assembly with different technologies and materials in own production: Chip on board (CoB), Chip on glass (CoG), Chip on ceramic (CoC), Chip on flex (CoX).

Our qualified specialists work in the clean room according to IPC specifications. We produce the finest connections using state-of-the-art technology. Integrated circuits or discrete semiconductors are connected to electrical connections of other components or housings by means of wire bonding. In chip bonding, the wafer is joined to the base plate by gluing, soldering or alloying.

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Chip bonding

Unpackaged semiconductor chips (bare dice) offer many advantages over conventional electronic components such as SMD components (surface mounted devices). In chip bonding, the individual semiconductor chips of a wafer are attached to a substrate using adhesive. We work with different technologies and processes:

  • Fully automatic feed and discharge systems for die-bonding
  • Die-bonding / chip-bonding with the insertion of components / chips from belts or trays and computer-controlled placement, immersion or dispensing
  • Plasma surface treatment of semiconductor materials, optical and structural elements

Our technologies for chip assembly

  • Chip assembly of semiconductor chips, LED, MMIC (Monolithic Microwave Integrated Circuit) with adhesives, sintered materials
  • Soldering materials on rigid and flexible substrates
  • Naked chip assembly / CoB (Chip-on-Board Technology)
  • CoG (Chip-on-Glass), CoX (Chip-on-Flex), CoC (Chip-on-Ceramic)
  • MEMS (microelectromechanical systems) chips (IR emitters, thermopiles, pyroelectric chips,...)
  • Processing of optical elements (IR filters, lenses,...)
  • Gap welding for wiring sensors with a printed circuit board

Wire bonding

Contacting of bare semiconductors is typically done by wire bonding. This visually verifiable contacting option is often used for packaging highly reliable circuits.

  • Fully automatic feed and discharge systems for die bonding
  • Die-bonding / chip-bonding with the insertion of components / chips from belts or trays and computer-controlled placement, immersion or dispensing
  • Plasma surface treatment of semiconductor materials, optical and structural elements

Bond technologies and microassembly services at a glance

  • Aluminium (Al) bond wires with a ø of 20 µm, 25 µm and 32 µm
  • Aluminium coated gold (Au) bond wires with a ø of 32 µm
  • Gold (Au) bond wires with a ø of 25 µm, 50 µm
  • Use of thermally conductive and electrically conductive adhesives and other materials such as silicone adhesives and sinter pastes
  • Plasma activation / purification of substrates
  • Electrode welding of TO housings (transistor outline)
  • Testing the tightness of housed parts with the coarse-fine leak test
  • Testing by artificial ageing of IR radiators
  • Fully automatic tester (pull test, shear test)
  • Electrical measurement at different temperature profiles
  • TO Caps from TO 46 to TO 8 package (4 x 8 inch LP)
  • Machine settable are the smallest components from 0,23 x 0,23 mm up to 10 x 12 mm

Within the scope of our development competences we can also realize individual requests.