Ceramic and Hybrid circuits hybrid thick-film technology

We manufacture thick-film circuits in small to medium quantities in-house and thus offer maximum efficiency in the manufacture of hybrid modules.

Especially for the miniaturization of electronics, there are hardly any alternatives to ceramic multilayer circuits. Hybrid circuits produced with thick-film technology are equipped with electronic components using different manufacturing techniques. The ceramic substrates used are low-loss insulators and resistant circuit carriers.

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In-house production of thick film substrates

We use modern screen printing machines for the application of resistors, conductor paths, contact systems and multi-level wiring carriers. We achieve special precision of the resistance value through active and passive laser alignment. Glazes and protective lacquers can also be applied by screen printing to protect the circuits.

Thick-film printing line at Micro-Hybrid in production
Screen printing line with magazine drying for the production of thick film substrates for ceramic multilayer circuits.

Trimming of resistors

During laser trimming, resistors in our thick-film circuits and on integrated circuits are adjusted to the exact resistance value (passive adjustment) or the function of the circuit (active adjustment). During the trimming process, the respective output signal is constantly measured and compared with the nominal value. When the target value is reached, the laser cut is automatically stopped.

Trimming of resistors
Laser trimming

Typical structure of a ceramic hybrid circuit

In electronics manufacturing, thick-film technology is used to manufacture multilayer printed circuit boards and hybrid circuits. The conductor paths are screen printed directly onto ceramic substrates, aluminium substrates or glass substrates. After drying and sintering a layer, this process can be repeated several times. Resistors are also printed and then laser trimmed to the required value.

Schematic of a typical structure of a ceramic multilayer circuit

Technical details

Further electronic components can be mounted using SMD assembly or THT assembly with subsequent soldering. Using chip-on board (bonding), we can also apply integrated semiconductors for complex circuits to the substrate.

Substrates: Al2O3, (Aluminium Substrate)
Standard size 4" × 4"
Standard substrate thickness 0,25 – 1 mm
Layer thickness Typical thickness ca. 5 ... 50 μm
Paste systems AgPd, AgPt, Au, Resistor pastes, dielectrics, overglaze
Construction Monolayer, Multilayer (typical: 4) duplex print, Metallized through-holes, vias, interlayer connection
Resistors Thick film pastes, trimmable, also PTC for sensor applications

We are happy to answer your questions about possible applications of thick film technology for your project.