Chip and wire bonding
Micromounting with various technologies and materials in our own production: Chip on Board (CoB) on various carriers such as Chip-on-Glass, Chip-on-Ceramic and Chip-on-Flex.
Our qualified specialists work in a clean room in accordance with IPC specifications. We use state-of-the-art technology to produce the finest connections. Integrated circuits or discrete semiconductors are connected to the electrical connections of other components or housings by wire bonding.
During chip bonding, the wafer is connected to the base plate by adhesive bonding.
Contact our application experts
Our chip assembly technologies
- Chip assembly of semiconductor chips, LED, MMIC (Monolithic Microwave Integrated Circuit) with adhesives, sintering materials
- Soldering materials on rigid and flexible substrates
- Naked chip assembly / CoB (Chip-on-Board Technology)
- CoG (Chip-on-Glass), CoX (Chip-on-Flex), (Chip-on-Ceramic)
- MEMS (microelectromechanical systems) chips (IR emitter, thermopile, pyroelectric chips, ...)
- Processing of optical elements (IR filters, lenses, ...)
- Gap welding for wiring sensors to a printed circuit board
Chip bonding
Housed semiconductor chips (bare dice) offer many advantages over conventional electronic components such as SMD components (surface-mounted devices). In chip bonding, the individual semiconductor chips of a wafer are fixed to a substrate with adhesive. We work with different technologies and processes:
- Fully automatic feed and removal systems for die bonding
- Die bonding / chip bonding with pick-up of components / chips from belts or trays and computer-controlled placement, dipping or dispensing
- Plasma surface treatment of semiconductor materials, optical and structural elements
Wire bonding
The contacting of bare dice is typically done by wire bonding. This visually verifiable contacting option is often used in the packaging of highly reliable circuits.</p
- Fully automatic feed and removal systems for die bonding
- Die bonding / chip bonding with pick-up of components / chips from belts or trays and computer-controlled placement, dipping or dispensing
- Plasma surface treatment of semiconductor materials, optical and structural elements
We will be happy to advise you on your development project and the optimum substrate and packaging technologies.
Direct contact to contact persons
Elektronische Mikro Systeme
Dipl. - Ing.
Thomas Bartnitzek
