Packaging Engineer / Engineer, Development of Assembly and Interconnection Technology (m/f/d)
Hermsdorf
Full time
Research & Development
Do you like to think ahead and want to use your creativity and drive to develop hybrid microsystems that truly make a difference? The best connections aren’t just made on the circuit board - they’re also forged within the team. We possess unique expertise in the development, manufacturing, and distribution of microelectronics and sensor technology. With vision, expertise, and ingenuity, we create custom electronics solutions and breathe life into our developments.
Let’s make the world a better place together. #betterworld
Your Responsibilities
- You will be responsible for coordinating and managing complex projects related to development and customer-oriented assignments in the field of hybrid microsystems—thick-film, LTCC, and PCB
- Your responsibilities will include implementing technical developments, including CAD layout and design tasks, feasibility studies, and prototyping.
- Working closely with other departments, you will be responsible for specifying development requirements and supporting the transition to series production.
- You will also be responsible for carrying out research and development tasks in close collaboration with external partners.
Your Profile
- Successfully completed bachelor’s or master’s degree with a focus on electrical engineering, precision engineering, materials science, mechatronics, natural sciences, or similar fields.
- Initial professional experience in a similar position
- Relevant knowledge in product management, electronics, and measurement and testing technology
- Solid knowledge and skills in appropriate analytical and statistical methods
- Demonstrated knowledge and experience with layout software
- Good written and spoken English skills
- Strong communication and teamwork skills, initiative, and flexibility