Microelectronics Assembly and Chip-on-Board Solutions

Our Chip-on-Board assembly capabilities cover the precise dies such as MEMS, LEDs, MMICs and passive chip components using application-specific adhesives, sintering materials and soldering processes. We process both rigid and flexible substrates and support a wide range of integration concepts, including Chip-on-Board, Chip-on-Glass, Chip-on-Flex and Chip-on-Ceramic.

Our expertise also includes the assembly of infrared emitters, thermopile and pyroelectric chips, as well as the integration of optical elements such as infrared filters and lenses. Gap welding can additionally be used to create reliable electrical connections between sensors and printed circuit boards. This broad range of technologies enables highly compact, precise and application-specific microelectronic modules.

We develop and manufacture customized modules for high-power LEDs and power semiconductors in bare-die or packaged form. Our assembly processes support UV, infrared and visible-light LEDs as well as diodes, transistors, IGBTs and other power components.

High energy densities, elevated currents and series-connected components place demanding requirements for thermal management, electrical insulation and interconnection technology. By selecting suitable substrates, joining materials and protection concepts, we ensure efficient heat dissipation and help prevent material degradation caused by high temperatures or UV radiation. The result is a compact and reliable module design tailored to the electrical, optical and environmental requirements of the application.

We develop and manufacture Multi-Chip Modules (MCMs) and advanced electronic packages entirely in-house. From substrate selection and chip assembly to interconnection, protection, testing and final module integration, all process steps are coordinated within a single production environment.

Our packaging solutions are designed for maximum reliability under harsh environmental conditions and can be engineered for operating temperatures up to 200 °C. This makes them particularly suitable for demanding applications such as deep-hole drilling, subsea systems and defense technology. The close coordination of all manufacturing stages ensures streamlined interfaces, consistent quality and reliable implementation from prototype to volume production.