Micro Hybrid supports OEM customers from initial concepts and feasibility studies through prototyping and series production. Our teams combine electronic and mechanical design, software, optics, microelectronic packaging, simulation and testing to align product requirements with manufacturing and validation from an early stage.
Our engineering capabilities cover analog and digital electronics, measurement and sensor electronics as well as application specific circuit development.
Key capabilities include:
The appropriate substrate technology is selected according to electrical, mechanical, thermal and environmental requirements. Micro Hybrid develops layouts for conventional PCBs as well as thick film and LTCC ceramic circuits. This enables the development of compact electronic modules for applications where installation space, temperature stability, reliability or packaging density exceed the capabilities of conventional PCB technologies.
Hardware development can be complemented by software for microcontroller and PC based systems. The electronic architecture, measurement functions and software are developed together according to the requirements of the final application. Simulation and testing throughout development help verify the interaction between hardware, software and sensor functions before the product is transferred into production.
Electronic performance and mechanical integration are considered together during development. Micro Hybrid provides mechanical 3D design, customized housings and application specific packaging concepts. Microelectronic packaging capabilities can be incorporated early in the design process, helping developers address miniaturization, thermal management, environmental protection and reliable interconnection between components.
Product development often requires more than the right design. Micro Hybrid also develops and qualifies the manufacturing technologies and processes needed to turn new concepts into reliable, repeatable production solutions. This includes substrate technologies, material combinations, assembly methods, packaging concepts and application specific process development.
Share your technical requirements, layout data or initial project specifications with our engineering team. We will assess the appropriate substrate technology, manufacturing processes and next steps for your application.
by Dustin Schönfeld
Seven cooperation agreements, a five-year partnership between Thuringia and Telangana, and new access to one of India’s most dynamic technology hubs. The Thuringian delegation’s visit has laid the groundwork for closer economic cooperation. For us, this marks the beginning of a crucial phase, as these new contacts are expected to lead to concrete projects in sensor technology and reliable electronics.
Working at Micro-Hybrid
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