Technology development & Process Engineering

New products can require adaptations to existing materials, assembly processes or packaging technologies. Micro Hybrid therefore develops and qualifies manufacturing processes alongside the product itself. Capabilities include the development of ceramic substrate technologies and new material combinations for thick film, LTCC, AlN, SiC and other substrate systems, as well as assembly, soldering, Chip on Board and hermetic sealing technologies.

From Manufacturing Planning to Stable Series Production

Micro Hybrid combines process engineering with manufacturing technologies including LTCC, thick film, SMD assembly, solder assembly, chip and wire bonding and circuit protection. This allows manufacturing requirements to be considered alongside the technologies ultimately used to produce the electronic assembly.

We use structured process engineering to transfer new products and electronic assemblies into controlled series production. Manufacturing planning, pilot production, inspection, risk assessment and production documentation are reviewed step by step before the manufacturing process is released. The process includes defined feedback loops. If manufacturing planning or pilot production does not meet the required criteria, corrective actions are initiated and the relevant process steps are evaluated again. This approach supports repeatable manufacturing, documented process quality and a controlled transfer to production.

A Controlled Path to Series Production

Our Process Engineering Capabilities

Manufacturing Planning and Process Readiness

Before production starts, the planned manufacturing process is reviewed for feasibility and completeness. Process risks, inspection requirements, production documentation and responsibilities are evaluated before pilot production is released.

Pilot Production and Process Verification

A defined pilot production run is used to verify the planned manufacturing process under production conditions. The manufactured assemblies are tested according to the applicable inspection plan, allowing process behavior and manufacturing stability to be evaluated before series release.

Process Risk Analysis and Quality Planning

Results from pilot production are incorporated into the Process FMEA and production control plan. Inspection plans, first article documentation and process related quality documents are updated where required. This creates a documented link between identified risks, manufacturing controls and inspection activities.

Optimization Before Production Release

If testing identifies opportunities to improve process stability, the manufacturing process can be adjusted before final release. When changes are required, the relevant planning and verification steps are repeated to confirm that the updated process meets the defined requirements.

Production Release and ERP Integration

Once the manufacturing process has been successfully verified, the production planning is formally released. The article is then approved within the ERP environment for production preparation and subsequent series manufacturing.

Documented Handover to Production

The completed process is transferred from process engineering to the responsible technology and production teams. Relevant specifications, manufacturing documents and training records are handed over to ensure that the approved process can be implemented consistently in production.

Let us evaluate your application.

Share your technical requirements, layout data or initial project specifications with our engineering team. We will assess the appropriate substrate technology, manufacturing processes and next steps for your application.

News and insights

by Dustin Schönfeld

Technology Partner India - Micro-Hybrid on a Delegation Trip

Seven cooperation agreements, a five-year partnership between Thuringia and Telangana, and new access to one of India’s most dynamic technology hubs. The Thuringian delegation’s visit has laid the groundwork for closer economic cooperation. For us, this marks the beginning of a crucial phase, as these new contacts are expected to lead to concrete projects in sensor technology and reliable electronics.

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