Circuit Protection and Encapsulation for Reliable Electronic Assemblies
Micro-Hybrid provides a wide range of circuit protection and encapsulation processes to safeguard electronic components and assemblies against moisture, contamination, mechanical stress and other external influences. Depending on the application, we use dip coating, passivation, potting, encapsulation and housing processes with carefully selected materials such as lacquers, pastes, parylene coatings or various epoxy and silicone based glob tops..
Technologies to protect circuits against environmental and chemically agressive influences by coating or housing
Protective Coating, Passivation and Encapsulation Processes
We offer a broad range of coating and encapsulation processes to protect electronic assemblies against moisture, contamination, chemicals and mechanical stress. Depending on the application requirements, components and circuit boards can be protected by dip coating, lacquer passivation, epoxy-based materials, potting or complete encapsulation. We also offer Parylene Coating.
Hermetic Sealing for Vacuum and Inert Gas Applications
We provide hermetic sealing solutions for electronic and microelectronic assemblies that require reliable protection against moisture, gases and other environmental influences. Depending on the housing and application, we use metal-to-glass, ceramic-to-metal and ceramic-to-ceramic sealing technologies.
Our capabilities include controlled bake-out and evacuation for vacuum applications, inert gas filling and a range of welding and brazing processes. These include laser welding, resistance welding, vacuum soldering and soldering under active or protective gas. The result is a durable, hermetically sealed package designed for demanding operating conditions and long-term reliability.
Leak Testing for Protective Coatings and Hermetic Housings
To verify the integrity of protected electronic assemblies and sealed housings, we offer gross leak testing and helium fine leak testing. Gross leak testing identifies larger defects in seals or housings, while helium fine leak testing detects even very small leakage rates. Together, these methods ensure that the required level of sealing and long-term protection is achieved.
FAQs Encapsultion and Circuit Protection
What types of coating does Micro-Hybrid offer?
We offer coating processes for different applications. Glob-Tops can be applied selectively in order to protect bare dies. Conformal coating can be applied to a specific area as well as the whole surface of the circuit board. Potting processes of the complete electronic assembly is possible as well.
The choice of material for the coating and potting processes is strongly dependent on the required level of protection, the compatibility to the assembled components as well as the achievable surface conditions.
What types of housing does Micro-Hybrid offer?
We can protect your circuit in a plastic, metal or ceramic housing. To guarentee hermetic sealing we utizile metal-glass, ceramic-metal and metal-metal closure.
What are the advantages of Parylene coating?
The Parlyene coating is deposited in a vacuum chamber by desublimation transitioning from gas into solid. Therefore it is applied very evenly all over the substrate and reaches areas that are inaccessible to liquid coatings.
Parylene serves very well as a protection against humidity and is strongly resistant to ageing influences. Consequently Parylene coating can be considered if your electronics are exposed to aggressive environmental conditions or must meet high safety and durability standards.
What testing capabilities do you have to assure proper sealing?
In order to detect leakages of all sizes we apply bubble tests and helium fine leak tests (using helium bombing or backfilling).
Environmental simulations can be arranged in-house (cold, dry and damp heat, rapid temperature change). Fore more details on climate simulation contact on our team.
What data/documents are required for a request?
In order to provide you with a quote the following information is relevant:
- areas that are supposed to be coated/encapsulated (ideally a proper drawing)
- requirements for the coating/encapsulation material
- drawing of the housing/package
- conditions the circuit protection must withstand (mechanical stress, humidity, gases, ...)
Let us evaluate your application.
Share your technical requirements, layout data or initial project specifications with our engineering team. We will assess the appropriate substrate technology, manufacturing processes and next steps for your application.
News and insights
by Dustin Schönfeld
Technology Partner India - Micro-Hybrid on a Delegation Trip
Seven cooperation agreements, a five-year partnership between Thuringia and Telangana, and new access to one of India’s most dynamic technology hubs. The Thuringian delegation’s visit has laid the groundwork for closer economic cooperation. For us, this marks the beginning of a crucial phase, as these new contacts are expected to lead to concrete projects in sensor technology and reliable electronics.
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13 Oct
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