PCBs and Ceramic Substrate Technologies from a Single Source
Micro-Hybrid combines LTCC, thick-film technology, SMD assembly, and advanced packaging technologies under one roof. This integrated approach gives you one reliable partner instead of several suppliers, reducing interfaces, administrative effort, costs, and supply chain complexity. Our broad technology expertise enables us to combine substrates, components, interconnection methods, and protection processes seamlessly. The result is a technically aligned, cost-efficient microelectronics solution ready for reliable series production.
Thick-Film-Substrates
Advantages & Applications of Thickfilm Substrates
Thick Film Ceramic as a substrate material, offers excellent heat conduction properties — the ideal foundation for demanding hybrid circuits. We realise printed resistors across a wide spectrum (from mOhm to GOhm) and can produce virtually any resistance value with high precision using laser trimming. Following component assembly, thick-film resistors undergo active calibration, ensuring maximum precision and reliability in our modules. Our hybrid circuits are deployed in demanding applications, where maximum reliability under extreme environmental conditions is essential. Typical fields of application include: Sensor technology, Special Power Modules, Defence and Aerospace.
Modern Thick-Film Manufacturing
Micro-Hybrid combines proven thick-film technology with a modern, digitally connected production environment. Integrated automated optical inspection and data processing identify possible deviations and give feedback in an early stage, keeping subsequent processes efficient. This ensures reliable quality, reduces scrap and supports cost-effective, dependable series production.
LTCC Technology - Multilayer Ceramic Substrates
PCBs and Advanced Ceramic Substrates - Microelectronics Technologies from a Single Source
Low-Temperature Cofired Ceramic (LTCC) technology enables the development of compact and highly reliable electronic solutions for particularly demanding operating conditions. At our in-house LTCC Competence Center, we combine extensive material, design and process expertise with many years of manufacturing experience.
This allows us to develop application-specific ceramic substrates and multilayer structures that meet high requirements for miniaturization, thermal stability, mechanical robustness and long-term reliability.
FAQs Ceramic Substrates and PCBs
Which ceramic substrates can be processed using thick-film technology?
The standard substrate material for single-layer thick-film circuits is 96% alumina (Al₂O₃). Multilayer and three-dimensional ceramic substrates can be manufactured using Low-Temperature Cofired Ceramic (LTCC) technology. For further information, please refer to our LTCC section.
When should LTCC be considered as a substrate technology?
LTCC should be considered when conventional FR4 circuit boards cannot meet the required performance or environmental demands. LTCC-based circuits are particularly suitable for applications exposed to high thermal and mechanical loads, humidity, aggressive gases, radiation or other harsh operating conditions.
Their multilayer and three-dimensional structure enables a high degree of miniaturization, functional integration and circuit complexity. è Ideally suited for aerospace, high-frequency electronics, security and medical technology, this technology excels wherever compact, highly reliable electronics are critical under demanding conditions.
Can you transfer my layout from FR4 to ceramic circuit boards?
Yes, we provide layout design services for ceramic circuit boards. With more than 30 years of experience in combining thick-film technology with subsequent assembly processes, we understand the specific requirements that must be considered during layout development. Each design is optimized for our manufacturing processes, helping to ensure reliable production, high quality and cost-efficient series manufacturing.
What data and documents are required for a quotation request?
To prepare an accurate quotation, we require the following information:
- Thick-film layout data in Gerber format, if the layout has already been finalized
- PCB layout data in Gerber format, if layout transfer and adaptation are required
- Bill of materials for any subsequent assembly processes
- Estimated production quantities
- Applicable standards and industry-specific requirements
- Required inspection and testing specifications
- Environmental and operating conditions to which the ceramic circuit board will be exposed
- Information on subsequent processes, such as SMD assembly, chip-on-board processing or complete module assembly
Which subsequent processes can be carried out after substrate manufacturing?
Once the ceramic substrate has been fully structured and sintered, it can undergo a range of subsequent processes, including SMD assembly, chip-on-board processes and complete module assembly.
Our high level of vertical integration covers the entire production chain, from ceramic substrate manufacturing and component assembly to the production of fully sealed modules. For further information, please refer to our Technologies section.
Let us evaluate your application.
Share your technical requirements, layout data or initial project specifications with our engineering team. We will assess the appropriate substrate technology, manufacturing processes and next steps for your application.
News and insights
by Dustin Schönfeld
Technology Partner India - Micro-Hybrid on a Delegation Trip
Seven cooperation agreements, a five-year partnership between Thuringia and Telangana, and new access to one of India’s most dynamic technology hubs. The Thuringian delegation’s visit has laid the groundwork for closer economic cooperation. For us, this marks the beginning of a crucial phase, as these new contacts are expected to lead to concrete projects in sensor technology and reliable electronics.
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